logo
Guangdong Taijin Semiconductor Technology Co., Ltd
Verified Supplier

Integrated Circuit IC Lead Frame Stamping Mold Wear Resistance

Contact Supplier
Product Details
Brand Name: TJIN
Place of Origin: China
Minimum Order: 1 set
Delivery Time: 40 days
Certification: ISO9001
Packaging Details: Wooden Packing
Application: Integrated Circuit (IC) Lead Frame Stamping
Material: Steel
Mold Hardness: HRC 50-60
Mold Life: 500,000-1,000,000 shots
Mold Material: SKD11, SKH-9, DC53, or customized
Mold Precision: ±0.005mm
Mold Size: Customized according to customer's requirements
Mold Surface Treatment: Nitriding, Vacuum Hardening, or customized
Mold Type: Single Cavity
Stamping Capacity: 500,000-1,000,000 pieces per month
Stamping Precision: ±0.01mm
Stamping Speed: 100-300 strokes per minute
Stamping Type: Progressive Die
Surface Treatment: Nickel Plating
Description
PRODUCT ADVANTAGES 1. High product precision 2. Professional precision manufacturing and long mold life 3. Food packaging hardware punching and ...

More IC Lead Frame Stamping Mold

Call Us
Contact Supplier