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Guangdong Taijin Semiconductor Technology Co., Ltd
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Automatic Semiconductor Packaging Equipment With Water Cooling System

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Product Details
Brand Name: TJIN
Model Number: 001
Place of Origin: China
Certification: ISO9001
Minimum Order: 1
Packaging Details: Wooden Packaging
Delivery Time: 40 days
Payment Terms: TT
Platen Size: 600 X 600 Mm
Clamping Force: 1000 KN
Max. Mold Height: 400 Mm
Cooling System: Water
Model: SM-1000
Control System: PLC
Injection Pressure: 200 MPa
Injection Unit: Single
Description
Max. Mold Height of 400 Mm Auto Packaging Equipment with Water Cooling System Product Description: Semiconductor Molding Machine - Product Overview ...

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